Solution

With federal support, Strategic Solutions proposes building a secure advanced semiconductor fabrication facility on U.S. soil using trusted supplier principles.

The MiniFoundry would ensure the availability of low-volume advanced semiconductor tools, development, and product by supporting the needs of government, research, and supporting for-profit industry. No device manufacturing would be done offshore or for offshore companies. The foundry will not provide products or services for any customer requiring large volume production. Our total focus is meeting the needs for U.S. microelectronics development and small-lot production.

The secure facility would provide foundry support for U.S.:
•    Semiconductor chip suppliers
•    Equipment suppliers
•    Materials suppliers
•    Trusted Suppliers
•    Government agencies

This focus will allow these organizations to conduct advanced development for their products with complete assurance that their work would not be compromised.

The MiniFoundry will have the ability to produce state-of-the-art 300mm devices as well as 200mm devices. The 300mm site would be capable of 22nm or better and the 200mm line would have the capability of sub 90nm or better and also support legacy products. We are seeking an existing 200mm facility that is upgradeable to 65nm. We would consider partnering with someone providing it works with this model. Likewise, we are seeking an existing 300mm facility using the same model. If we are not successful in obtaining one or both, then we propose building new greenfield manufacturing facilities.

Additionally, we are seeking advanced technology for the MiniFoundry to reduce, and in some cases eliminate, the high cost of lithography and masking. We are also looking at advanced engineering tools that cut development time and cost in half. Examples include new tools in development today that promise to eliminate the need for masks, which would dramatically cut lithography costs and time-to-market. We are also looking at incorporating existing technology that can reduce process development time by up to 50%.

By focusing on a lower volume, we will be able to manufacture a higher number of discrete parts and incorporate multiple process technologies. At the same time, we believe we can improve the cost of service and process control of these advanced tools.

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